Insights
Technical notes and white papers on metrology for hybrid bonding and advanced packaging.
Technical note5 min read
A century per wafer: the AFM throughput problem, and how parallel heads change it
The back-of-the-envelope math behind AFM’s throughput limit, and how putting many small heads over one wafer changes it.
Technical note4 min read
Below 2 µm pitch: where optical metrology needs an AFM reference
Hybrid-bonding pitch keeps shrinking, and research is already below 1 µm. What happens to pad-level metrology as pads approach the optical resolution limit.
Technical note4 min read
Hybrid-bond yield starts at CMP
In hybrid bonding, the bond is decided before the wafers ever meet. Why controlling CMP does the most for HBM yield.
Application note4 min read
Beyond HBM: SiC, EUV masks and 3D transistors
The same need for fast, direct 3D surface data shows up across substrates, masks and logic. A tour of where high-throughput AFM fits next.